91´«Ã½

1991–2000

• 2000 Publications

  • by BCME Faculty and Students

    1. Abtew, M. and G. Selvaduray, "Lead-Free Solders in Microelectronics," Materials Science & Engineering Reports, Vol R27, Nos 5-6, June 1, 2000.
    2. Selvaduray, G, "Recyclability of Microelectronic Systems," Advances in Packaging Development and Research, Edited by J.A. Marcondes, (June 2000) pp 450 - 460. 
    3. Selvaduray, G, "Sintered Architectural Glass Tiles from Recycled Glass," Advances in Packaging Development and Research,, Edited by J.A. Marcondes, (June 2000) pp 461 – 467.
    4. Lee, W., L.T. Nguyen and G. Selvaduray, "Solder Joint Fatigue Models – Review and Applicability to Chip Scale Packages," Microelectronics Reliability, 40 (2000), pp 231-244.
• 1998 Publications

  • by BCME Faculty and Students

    1. Selvaduray, G., "Transforming the Mechanical Engineering Curriculum to meet the Challenges of the 21st Century," Invited paper for the Journal of the Japan Society of Mechanical Engineering, November, 1998.
    2. Selvaduray, G., "Effect of the Hanshin-Awaji Earthquake on Manufacturing Industries," Proceedings of the Sixth National Conference on Earthquake Engineering, EERI, Oakland, California, May 1998.
    3. Selvaduray, G., "Earthquake Caused Hazardous Materials Incidents at Educational Facilities", Seismic Design, Retrofit and Performance of Nonstructural Components, Applied Technology Council, Redwood City, California, (January 1998)
• 1997 Publications

  • by BCME Faculty and Students

    1. Trigwell, S., R. Hayden, K. Nelson and G. Selvaduray, "Effects of Treatment on the Surface Chemistry of NiTi Shape Memory Alloys", Journal of Surface and Interface Analysis, June, 1997.
    2. Thomas, S., E. Hasenkamp and G. Selvaduray, "Determination of Oxygen Diffusion in Ionic Solids", The Journal of Materials Education, Vol 19, No. 3, pp 213-215.
    3. Hilden, J., K. Lewis, A. Meamaripour and G. Selvaduray, "Measurement of Springback Angle in Sheet Bending", The Journal of Materials Education, Vol. 19, No. 3, pp 185-198.
    4. Chao, J., S. Curotto, C. Anderson and G. Selvaduray, "The Effect of Surface Finish on Tensile Strength", The Journal of Materials Education, Vol. 19, No. 3, pp 199-212.
    5. Selvaduray, G., W. Lee and S. Yee, "Effect of Surface Treatment on the Wetting Force of Eutectic Pb-Sn Solder on Copper Substrates", Design and Reliability of Solder Joints and Interconnects, R. K. Mahidhara, et al. Ed., TMS, Pennsylvania, (1997), pp 259-266.
    6. Trigwell, S., and G. Selvaduray, "Effects of Surface Finish on the Corrosion of NiTi Alloy for Biomedical Applications", Proceedings of the Second International Conference on Shape Memory and Superelastic Technologies: Engineering and Biomedical Applications, Pacific Grove, California, (March 2-6, 1997)
• 1996 Publications

  • by BCME Faculty and Students

    1. Trigwell, S., G. Selvaduray and A. Singh, "Effects of Intermetallic Compound Formation on the Electrical Performance of Wirebonded Interconnects", Intl. J. of Microcircuits and Electronic Packaging, Vol. 19, No. 1, First Quarter 1996. pp 14-21.
    2. M.A. McNeil, J. Boothby, and P. Stacks, Development of a Multi-Disciplinary Biochemical Engineering Laboratory, Speaker at the1996 American Society for Engineering Education Summer National Meeting, Washington D.C.
• 1995 Publications

  • by BCME Faculty and Students

    1. Selvaduray, G., "Environmental Integration and Technologies", Advanced Manufacturing: Technology and International Competitiveness, UCRL-ID-120595, Feb 1995.
    2. Selvaduray, G., "Undergraduate Engineering Ceramics Laboratory Development", International Journal of Engineering Education, Vol. 11, No. 4-5, (1995) pp 374-379.
    3. D.A. Cacciatore, and M.A. McNeil, Applications of Biological Treatment to Industrial Waste, BioCycle, October 1995, pp. 61-64.
• 1994 Publications

  • by BCME Faculty and Students

    1. Selvaduray, G. and A. Singh, "Modeling of Flip-Chip-Bonded and Wire-Bonded MCM Interconnects for Electrical Performance Comparison", Intl. J. of Microcircuits and Electronic Packaging, Vol. 17, No. 1, First Quarter 1994. pp 14-21.
    2. Aggarwal, I. and G. Selvaduray, "Role of CuxSny Intermetallics in the Reliability of Controlled Collapsed Chip Connection (C4)", Proc. 8th International Electronic Materials & Processes Conference, ASM International, San José, California, August 1993. pp 75-82.
• 1993 Publications

  • by BCME Faculty and Students

    1. Selvaduray, G. and L. Sheet, "Aluminum Nitride: A Review of Synthesis Methods", Materials Science and Technology, June 1993, Vol. 9, pp 463-473.
• 1992 Publications

  • by BCME Faculty and Students

    1. Selvaduray, G., C. Zhang, et al, "Effect of CO2 on the Processing of Y-Ba-Cu-O Superconductors", Journal of Materials Research, Vol. 7, No. 2, Feb 1992, pp. 283-291.
• 1991 Publications

  • by BCME Faculty and Students

    1. Selvaduray, G., "Materials Selection Parameters for Ceramic Substrates: Property-Processing Relationships", Materials Developments in Microelectronic Packaging: Performance and Reliability, P. Singh, Ed., ASM International, (1991) pp 29-35.
    2. Balachandran, U., D. H. Xu, G. Selvaduray, et al, "Characterization of YBCO Superconductors Sintered in CO2-Containing Atmospheres", Ceramic Transactions, Vol. 18, 1991. pp 341-355.